Dr. Dokmeci is Associate Professor at the Institute. Previously, he was an Associate Adjunct Professor in the Radiology Department at the University of California-Los Angeles from November 2017 to June 2020. Prior to that he was an Instructor at Brigham and Women’s Hospital, Harvard Medical School, a position he has held for 7 years. Before then, he was on the faculty of the Electrical and Computer Engineering Department at Northeastern University. Before joining academia, he had 4 years of industrial experience at Corning-Intellisense Corporation, Wilmington, MA, developing MEMS-based products for the telecommunications and life science industries. He has served as the program organizer and chair for many conferences, such as organizer and chair of the 31st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS Technical Committee on Bio-Micro-Electro-Mechanical Systems (TC-BioMEMS) and Session Chair of Society of Experimental Mechanics Annual Conference, Springfield. he has extensively published in refereed journals and conferences in the areas of MEMS, Micro- and Nanotechnology, and Bio-Chemistry. He is also a long term member of the Institute of Electrical and Electronics Engineers (IEEE), Materials Research Society (MRS), American Chemical Society (ACS), and American Association for the Advancement of Science (AAAS). He has a strong background and more than a decade of experience in designing and fabricating micro and nanoscale sensors and systems, biomedical devices, tissue engineering, and implantable biosensors. He has been actively involved in research areas such as flexible electronics for monitoring and modulation of wound healing, electrical/electrochemical biosensors and microfluidic systems for organs-on-a-chip applications and 3D bioprinting. He has authored more than 158 journal papers, 6 patents/disclosures; 112 conference publications/abstracts, has an h-index=66, citations > 16,300.